[High- tech
LED reporter / Long Zonghui] Recently, Han's Laser (SZ.002008) released the 2013 half-year performance report, the data shows that the company's total operating income in the first half of the year was 2.065 billion yuan, an increase of 18.53% compared with the same period last year, operating profit 161 million, an increase of 11.52% compared with last year.
Tang Jiangang, head of the Dazu Laser Precision Laser Micromachining Center, said that thanks to the expansion of the chip factory, the sales of LED stealth dicing machines increased by 200% in the first half of the year. At present, the company has obtained orders for dicing machines from Tongfang Optoelectronics and Hualei Optoelectronics. In addition, it is already in contact with Sanan Optoelectronics and Dehao Runda. It is expected that the revenue in the second half of the year will be very promising.
For the first half of the year, the unit price of the Dazu laser dicing machine has been lowered to a certain extent. Tang Jiangang said that on the one hand, it benefits from the decline in equipment manufacturing costs, because some imported parts can now be completely replaced with domestically produced products; The continuous development of lasers has increased production efficiency by 20%-30%.
“The current price decline is in the normal range, and the product cost performance has been further improved accordingly.” Tang Jiangang said that in addition to the mainland, Han’s laser has already sold its products to Taiwan and Europe, but in his view, the future continent Still the main battlefield of the Han family laser.
This year's large-scale expansion of the chip factory has largely benefited from the unexpected growth of the LED lighting market in the first quarter of this year.
Wang Lianghai, vice president of Tongfang Group, said that in the first quarter, their equipment was running at full capacity, and there were also cases of chips waiting for customers. Last year, 50% of the entire upstream MOCVD equipment was still idle.
This has also been confirmed in the published quarterly and semi-annual reports of chip-listed companies, and most companies are planning to actively expand production.
Among them, Sanan Optoelectronics disclosed in the semi-annual report that more than 130 MOCVD equipments of its subsidiaries have been in full production, and the total number of units has reached 144 sets.
In the first quarter of this year, Dehao Runda also made it clear that the MOCVD equipment they ordered from Veeco had a total of 80 units, 45 of which had been commissioned and 5 of which were used for R&D.
In the first half of the year, Silan also said that a 4-cavity MOCVD equipment purchased from US Applied Materials has been put into production in the early stage. By the end of the first half of the year, 15 MOCVD equipments funded by Silan Mingxin had all been put into production. .
“Every 2 MOCVD equipments must be equipped with a stealth dicing machine.” Tang Jiangang expressed confidence in equipment sales in the second half of the year. Although the LED lighting terminal market may have uncertain fluctuations in the second half of the year, MOCVD equipment expansion Generally, the expansion plan will be made ahead of the downstream market. The impact of the expansion plan of the chip companies in the first half of the year will not be too great.
However, Tang Jiangang said that the current LED laser dicing machine involves two methods: table cutting and lead wire. Although the lead wire method is very popular in the past two years, the LED laser dicing machine for table cutting has a comeback trend, and the current technical direction is still in the swing stage.
According to the reporter's understanding, the lead LED laser dicing machine is easy to operate for the chip factory, and will greatly improve the yield. However, the yield of LED laser dicing machines using Taiwan's Jingyuan Optoelectronics and some foreign manufacturers using table-cutting methods is also higher than that of some enterprises in mainland China. There are many uncertain factors in the future technology trend.
In addition to the traditional sapphire substrate, the silicon substrate technology route has not achieved good market validation, but companies are still actively developing trial production. Compared with sapphire and SiC, silicon substrates have the advantages of low cost, large size, high quality, good electrical conductivity, etc., and the development of GaN-based materials and devices on silicon substrates will further promote the process of GaN-based devices and conventional silicon substrate devices. The integration is considered a promising technical route.
"Our LED laser dicing machine for silicon substrate has been developed and has begun to accept customer test machines." Tang Jiangang said.
The reporter visited and learned that Taiwan Semiconductor Manufacturing Co., Ltd. and China's Crystal Energy Optoelectronics have already produced silicon substrate chip products. Especially, under the same conditions of TSMC's silicon substrate, the brightness is close to 95% of the SIC substrate. The brightness of the silicon substrate also reached 130-140 lm/W.
Tang Jiangang believes that Han's laser is very optimistic about the application prospects of silicon substrates. The current bottleneck still has a certain gap between cost and sapphire and SiC, but he believes that silicon substrates will surely occupy a place in the market in the near future. Silicon materials are generally more brittle than sapphire, so we have done a series of technical research and development in laser cutting, and we have already started to contact with Epistar.
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