On May 23, Cree (Nasdaq: CREE) officially announced the launch of XLamp® XP-L LED, the industry's first commercial single-chip high-power capable of achieving 200 lm/W light efficiency at 350 mA. LED packaged devices.
The XLamp® XP-L LED is available in a package size of 3.45 mm x 3.45 mm and provides up to 1,226 lm of luminous flux. The XLamp® XP-L LED's superior features, which can change existing game rules, will bring an immediate upgrade to the current XLamp® XP-G LED-based lighting design, achieving a 50% or higher performance upgrade.
Cree's new high-density XLamp® XP-L LED
Mike Joye, president of Auroralight, said: "We are excited about the introduction of the new high-density XLamp® XP-L LEDs. The high-performance advantages of XLamp® XP-L LEDs will bring a new generation of light to our directional lighting products. Output and efficacy. At the same time, XLamp® XP-L LEDs use the same package size as the original XP series, helping us to quickly achieve significant performance gains with existing lighting product lines without increasing the time and cost of product development. ."
Cree's new XLamp® XP-L LEDs are the brightest in the industry's line of high-density discrete LED package devices, with the industry's highest optical control factor, OCF. Optical Control Factor OCF is an important way to evaluate LED size and performance in directional lighting applications. With the advantages of OCF, a high optical control factor, XLamp® XP-L LEDs will help lighting manufacturers improve the performance of their original XP-based packaged lighting designs, resulting in smaller size and lower cost for new lighting designs, while being indoors A variety of different lighting applications, such as lighting and outdoor lighting, lead to more innovative solutions.
Jason Gerard, general manager of Gerard Lighting Group's engineering group, said: "We have tried many different high-power LED packaging devices before, and finally decided to choose Cree's new high-density discrete LED packaging devices. Cree high-density LED packaging The device helped us achieve the intended lighting design goals and developed the core lighting design, which was not possible with other LED packaging devices. We are pleased to see that Cree's latest innovations have brought us outstanding products. Features that enable product differentiation."
Cree XLamp® XP-L LEDs feature a current rating of 1,050 mA and a temperature of 85 °C, with a color rendering index of up to 90 and a color temperature option from 2,700 K to 8,300 K. XLamp® XP-L LEDs, a descendant of XLamp® XM-L2 LEDs, help ENERGY STAR® certified lighting manufacturers to provide only 3,000 hours of LM-80 data, saving significant approval processes time.
A new generation of high-density LED packaged devices represented by XLamp® XP-L LEDs will be produced at Cree China's Huizhou plant. As early as 2009, Cree took the lead in building the world's first-class LED chip and packaging factory in Huizhou, China, and undertaked the comprehensive process of LED wafer cutting, device packaging, testing, sorting, etc., and further integrated the Cree LED industry chain. The earth enhances LED production capacity and fully meets the global LED market development needs. The Cree China Huizhou plant started production of the first batch of products on July 1, 2010, providing the highest quality products of Cree to the LED market in China and the world.
Cree XLamp® XP-L LEDs are available now for sample applications and are available for volume production on standard delivery times. For more information, please visit
Cree will participate in the 2014 Guangzhou International Lighting Exhibition held at Guangzhou Pazhou Exhibition Hall on June 9-12. The Cree booth is located at booth B02 in Hall 4.1, Area A. The latest generation of high-density LED technology and products from Cree will be on display.
Cree China WeChat public platform is now open, please search for the micro-signal Cree_China or scan the QR code below for attention.
(This article is contributed by Cree)
